ISO 16525-9:2014 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board. It also investigates the characteristics of wiring with an isotropic electrically conductive adhesive, which can be applied on to the printed circuit board.
Status: PublishedPublication date: 2014-05
Edition: 1Number of pages: 45
Technical Committee: ISO/TC 61/SC 11 Products
Buy this standard
|std 1 166||PDF + ePub|
|std 2 166||Paper|